Semi-automatic wafer tape mounting equipment for dicing

Equipment model

• GTR306 series

Product features

• Advanced anti-static roller tape mounting technology is applied
• Automatic tape feeding & tape mounting
• Manual wafer/wafer ring loading and unloading
• Manual tape dicing
• Automatic waste tape collection

Technical specification and parameter

• Wafer type: silicon wafer/silicon carbide/gallium arsenide
• Wafer size: 4"~ 8"/ 8" ~12"
• Wafer thickness: 4"~ 8" ≥ 100um; 12" ≥ 200um;
• Tape type: Blue tape/UV tape
• Tape width: Max. 420mm
• Ring spec.: 6"/8"/12"Disco standard ring
• Carrier type: Vacuum airway, porous metal and microporous ceramics are optional
• Power consumption: AC220V 5A
• Control system: PLC & 7" touch screen
• Electrostatic elimination: Ion air pump