Line scanning type UV Curing Equipment

For semiconductor post-process, the process equipment for ungluing UV tape after the process of mounting UV tape on wafer or substrate.

• Corresponding processing of 4"~12" wafer products/substrates
• Corresponding processing of UV tape

Product features

• Manual wafer loading and unloading
• Irradiation time is controllable
• Embedded ultraviolet sensor (optional)
• High intensity ultraviolet energy output
• LED lamp bead with long service life

Technical specification and parameter

• Ring size: ≤ 12"
• Tape type: UV tape
• UV lamp wavelength: 365nm
• Light source form: LED array
• Irradiation mode: Line scanning mode
• LED life: 15000h
• Power consumption: AC220V 5A
• Control system: PLC & 4.3" touch screen