Full-automatic wafer tape mounting equipment for thining

ATW5000 series tape mounting machine is applicable to the tape mounting process before wafer thinning. Advanced roller tape mounting technology is applied to the equipment, which can complete the contact tape mounting process of 8/12 inch wafer.

Product characteristics

• Advanced anti-static roller tape mounting technology is applied
• Automatic tape transfer and tape mounting (special mechanism can realize low tape tension)
• Automatic, safe and accurate transfer of wafers (Robot)
• Automatic intelligent detection of wafers in the cartridge to obtain wafer position information
• Auto-dicing of tape, auto-winding of waste tape
• Automatic non-contact wafer X-Y-θ position correction
• Vacuum or Bernoulli wafer handling technology
• SECS/GEM or simple networking capability

Technical specification and parameter

• Wafer type: silicon wafer/silicon carbide/gallium arsenide
• Wafer size: 6"~12"
• Wafer thickness: 6"~8" ≥ 100um; 12" ≥ 200um;
• Tape type: Blue tape/UV tape/DAF tape ("three-in-one" tape compatibility functions are optional)
• Ring type: 6"/8"/12"Disco standard ring
• Carrier type: Vacuum airway, porous metal and microporous ceramics are optional
• Power consumption: AC220V 8A
• Control system: PC+PLC control
• Electrostatic elimination: Ion wind rod