Full-automatic wafer tape mounting equipment for dicing

Equipment model

• GTR500 series

Product features

• Advanced anti-static roller tape mounting technology is applied
• Manual wafer/wafer ring loading and unloading
• Automatic tape feeding/mounting/dicing (DAF tape automatic alignment/peeling/mounting)
• Self-winding adhesive tape isolation tape
• Automatic winding of waste tape

Technical specification and parameter

• Wafer type: silicon wafer/silicon carbide/gallium arsenide
• Wafer size: 4"~ 8"/ 8" ~12"
• Wafer thickness: less than 8" ≥ 100um; 12" ≥ 200um;
• Tape type: Blue tape/UV tape/DAF tape ("three-in-one" tape compatibility functions are optional)
• Tape width: Max. 420mm
• Ring spec.: 6"/8"/12"Disco standard ring
• Carrier type: Vacuum airway, porous metal and microporous ceramics are optional
• Power consumption: AC220V 8A
• Control system: PLC & 7" touch screen
• Electrostatic elimination: Ion air pump