Vertical semi-automatic Wafer splitting equipment

Semiconductor post-process, the wafer non-contact splitting process equipment after wafer laser stealth dicing process.

• Corresponding processing of 4"~12" wafer products
• Corresponding processing of blue tape, UV tape

Product features

• Advanced non-contact splitting technology is applied
• Manual wafer loading and unloading
• Vision-assisted wafer position calibration
• Bidirectional automatic wafer splitting
• It is applicable to laser stealth dicing and knife dicing

Technical specification and parameter

• Wafer size: 4"~ 8"
• Chip size: 0.1mm~0.25mm
• Wafer thickness: ≤ 250um
• Tape type: UV tape
• Wafer type: Silicon wafer
• Ring type: 6"/8"/12"Disco standard ring
• Reserved thickness for dicing: 5~15um
• Capacity: 30PCS/h
• Power consumption: AC220V 8A
• Control system: PC+PLC control
• Electrostatic elimination: Ion fan