Semi-automatic wafer tape mounting equipment

Wafer tape mounting process equipment before wafer thinning and dicing process in

semiconductor post-process.

• Corresponding processing of 4"~8"/8"~"12" wafer products
• Wafer Taper corresponding handling of tape thinning. After replacing the module, the platform can handle LC tape or PR tape
• Wafer Mounter corresponding handling of cut tape (Blue/UV/DAF tape)

Product features

• Advanced anti-static roller tape mounting technology is applied
• Automatic tape transfer and mounting
• Automatic waste tape winding
• Manual wafer loading and unloading
• Manual tape dicing

Technical specification and parameter

• Wafer type: silicon wafer/silicon carbide/gallium arsenide
• Wafer size: 4"~ 8"/ 8" ~12"
• Wafer thickness: ≥ 300um
• Tape type: Blue tape/UV tape
• Tape width: Max. 340mm
• Carrier type: Vacuum airway, porous metal and microporous ceramics are optional
• Carrier heating: Room temperature ~ 100℃
• Power consumption: AC220V 5A
• Control system: PLC control & 7" touch screen
• Electrostatic elimination: Ion fan